Co-Packaged Copper (CPC) for Ultra‑High‑Speed AI Interconnects -

Directly integrates copper connectors into chip packages, enabling “chip-to-copper” connections that bypass PCB traces. Reduces signal loss by 60%+ and cuts latency to sub‑millimeter levels, critical for AI/ML GPU clusters and 3.2T+ switches.

Brocade + Samtec’s 512-lane CPC solution delivers 102.4T throughput; Luxshare-Tech targets 448Gbps copper interconnects for next-gen AI racks.